Tower Semiconductor Ltd. (Tower) operates as a pure-play independent specialty foundry.
The company is dedicated to provide high-value, high-quality, processed wafers to the company’s customers for their end products and end users. The company’s foundry processes use chemical materials, chemical processes and other materials and equipment on silicon wafers, based on the design specifications of the company’s customers. As a pure-play foundry, the company does not offer products of its own. The...
Tower Semiconductor Ltd. (Tower) operates as a pure-play independent specialty foundry.
The company is dedicated to provide high-value, high-quality, processed wafers to the company’s customers for their end products and end users. The company’s foundry processes use chemical materials, chemical processes and other materials and equipment on silicon wafers, based on the design specifications of the company’s customers. As a pure-play foundry, the company does not offer products of its own. The company offers the process technology geometries of 0.35, 0.50, 0.55, 0.60, 0.80-micron and above on 150-mm wafers and 0.35, 0.18, 0.16 and 0.13 -micron on 200-mm wafers and 65 nanometer on 300-mm wafers. The company also provides design support and complementary technical services. The company’s customers and/or its customers’ customers use the wafers for their end products, which are sold and/or used in diverse markets, including consumer applications, personal computers, communications, handsets and smartphones, automotive, industrial, aerospace and medical devices.
The company is focused on establishing leading market share in high-growth specialized markets by providing the company’s customers with high-value, high quality, wafer foundry services. The company uses standard analog complementary metal oxide semiconductor (‘CMOS’) process technology, , as well as specialized specific technologies including CMOS image sensors, non-imaging sensors, including sensors on Gallium Nitride, micro-electromechanical systems (MEMS), wireless antenna switch Silicon-on-Insulator (SOI), mixed-signal, radio frequency CMOS (RFCMOS), bipolar CMOS (BiCMOS), and silicon-germanium BiCMOS (SiGe BiCMOS or SiGe), silicon photonics, high voltage CMOS, radio frequency identification (RFID) technologies and power management. To better serve the company’s customers, the company has developed and is continuously expanding its technology offerings in these fields.
The company’s Fab 1 facility has process geometries ranging from 1.0-micron to 0.35-micron. During the first quarter of 2024, the company determined to re-organize and re-structure the company’s Israeli operations, through the cessation of its Fab 1 operations within approximately one year and the integration of a portion of the company’s 6’, Fab 1 operations (150mm) into the company’s 8’, Fab 2 operations (200mm), in order to optimize the company’s operations due to anticipated changes in market dynamics and customer demand.
In September 2023, Tower and Intel entered into an agreement under which Tower will have access to a 300mm capacity corridor in Intel’s facility in New Mexico, the United States.
Processes Manufacturing Services and Specialized Technologies
The company uses silicon wafers based on customers’ proprietary designs to perform an intricate process that consists of constructing layers of conducting and insulating materials on raw wafers in intricate patterns which requires hundreds of interrelated steps performed on different types of equipment, and each step must be completed with extreme accuracy to achieve good device performance metrics. In some cases, the company provides its customers with its own proprietary or third-party design elements. The company performs a series of processes, in which photosensitive material is deposited on the wafer and exposed to light through a mask, and hundreds of steps (moves) per wafer, including photolithography, oxidation, etching and stripping of different layers and materials, ion implantation, deposition of thin film layers, chemical mechanical polishing and thermal processing. The final step is wafer probing, which involves inspection of each unit in order to identify those that are operable for assembly. Customers often use third party service providers for the performance of wafer probing. In most cases, the company’s customer assumes responsibility for dicing, assembly, packaging and testing.
The company’s customers are fabless companies and IDMs, as sole source or second source, and enable smooth integration of the semiconductor design and wafer processes. By doing so, the company enables its customers to bring high-performance, highly integrated end products to market rapidly and cost effectively. The company’s technological strengths and emphasis on customer service have allowed the company to develop a unique position in large, high-growth specialized markets for CMOS image sensors, RF, power management and high-performance mixed signal applications.
The company’s manufacturing process is using specialty process technologies, mostly based on CMOS process platforms with added features to enable special and unique functionality, decreased footprint of products, competitive performance and cost advantages for analog and mixed-signal semiconductors. Products made with the company’s specialty process technologies are typically more complex than products made using standard process technologies employing similar technology nodes. Generally, customers that use the company’s specialty process technologies cannot easily transfer designs to another foundry because the analog characteristics of the design are dependent upon the specific process technology used. The specialty process design infrastructure is complex and includes design kits and device models that are specific to the foundry in which the process is implemented and to the process technology itself. In addition, the relatively small engineering community with specialty process expertise and the significant investment required for development or transfer and maintenance of specialty process technologies has limited the number of foundries capable of offering specialty process technologies. The company’s specialized process technologies combined with dedicated design enablement capabilities distinguish the company’s services and attract industry-leading customers.
The company also offers process transfer services to IDMs that wish to use their own technologies and processes. The company’s process transfer services are also used by fabless companies with proprietary process flows that wish to have an additional supplier for purposes of geographic diversity or for the manufacture of an advanced technology node that is very costly to build themselves. The company’s process transfer services include development, transfer, and extensive optimization as defined by customer needs.
With the company’s engineering team, well established transfer methodologies and vast experience, the company offers factories for core bulk CMOS and specialized technologies, such as RF SOI, integrated into back-end-of-line (BEOL) TMR/MTJ (magnetic tunnel junction) sensors, silicon photonics, SiGe and MEMS, among others.
The company is a trusted, customer-oriented service provider that has built a solid reputation in the foundry industry over more than thirty years. The company has built strong relationships with customers. The company’s consistent focus on providing high-quality, value-added services, including engineering and design support, has allowed the company to attract customers that seek to work with a proven provider of foundry solutions. The company’s emphasis on working closely with customers and accelerating the time-to-market and performance of their next-generation products has enabled the company to maintain a high customer retention rate, while increasing the number of new customers and new products.
The company continuously targets to expand its capacity footprint and business by attracting new customers that will utilize the company’s existing capacity, some of which have recently implemented further capacity expansion projects, as well as by acquiring external capacity through acquisitions of existing or newly established fabs, as the company has done in the past, with or without third-party collaboration and/or funding (including cash, equity or in-kind investment).
The company also offers from time to time a wide range of support services for the establishment of new semiconductor fabrication facilities or the ramp up of existing facilities owned by third parties, using the company’s technological, operational and integration expertise, for which the company receives payments based on the achievement of pre-defined milestones and may also be entitled to certain capacity allocation and other rights, all subject to definitive agreements underlying such projects.
The company derived a significant amount of its revenues for the year ended December 31, 2023 from the company’s target specialized technologies: RF CMOS, including RF SOI (RF CMOS on silicon-on-insulator), SiGe BiCMOS, power and discrete devices, CMOS image sensors and non-imaging sensors. The company is highly experienced in these technologies, having been an early entrant and having developed unique proprietary technologies, including through licensing and joint development efforts with the company’s customers and other technology companies.
CMOS Image Sensors
CMOS image sensors are ICs used to capture an image in a wide variety of consumer, communications, medical, automotive and industrial market applications, including camera-equipped cell phones, digital still, video, security and surveillance cameras, and video game consoles. The company’s process technologies assure consistently high performance of the integrated sensor through wafer-level characterization. The company’s CMOS image sensor processes have demonstrated superior optical characteristics, excellent spectral response and high resolution and sensitivity. The ultra-low dark current, high efficiency and accurate spectral response of the company’s photodiode enable faithful color reproduction and acute detail definition.
The company is actively involved in the high-end sensor and applications specific markets, which include applications such as high end video, high end photography, industrial machine vision, dental x-ray, medical x-ray, automotive sensors, security sensors and time of flight (ToF) three dimensional sensors for entertainment, commercial and industrial applications, as well as image sensors with record frame rates for registration of ultra-fast processes.
The company gained the market potential using CMOS process technology for a digital camera-on-a-chip, which integrates a CMOS image sensor, filters and digital circuitry. Upon entering the CMOS image sensor foundry business, the company utilized research and development work that had been ongoing since 1993. The company’s services include a broad range of turnkey solutions and services, including silicon proven pixels portfolio, optical characterization of a CMOS process, an innovative patented stitching manufacturing technology for large sensors, up to a one die per 300mm wafer and prototype packaging. The CMOS image sensors that the company manufactures include 180nm on 200mm wafers and 65nm on 300mm wafers with pixel sizes down to 1.12 micron utilizing dual light pipe technology, delivering outstanding image quality for a broad spectrum of digital imaging applications.
Specifically, the company’s CIS portfolio includes pixels ranging from 1.12 micron up to 150 microns, all developed by the company. The company provides both rolling shutter and global shutter pixels. The latter are used mainly in the industrial sensor and in the three-dimensional sensor markets. The company’s advanced technology used in CMOS image sensors enables improved performance, such as low dark current, low noise, high well capacity, high quantum efficiency and high uniformity of pixels utilizing deep sub-micron process technologies, enabling the company to offer very sophisticated and high performance camera module solutions. The company’s pixels are used in a variety of new markets, such as the high-end machine vision cameras and the rapidly growing ToF 3D sensor market. In addition, the company’s advanced global shutter technology and global shutter pixels, as small as 2.5um, enable excellent performance, especially, very high shutter efficiency.
For the X-ray market, the company offers its patented ‘stitching’ technology on 0.18-micron process, as well as on 65nm technology on 300mm wafers and a variety of 15 to 150-micron pixels that are optimized for X-ray applications. These pixels are used by the company’s customers in dental (intra and extraoral) and other medical X-ray products (such as C-Arm surgery machines, angiography and mammography), as well as in the industrial NDT (Not Destructive Testing) X-Ray market.
The company’s stitching technology, a cornerstone of its X-Ray sensors technology, enables semiconductor exposure tools to process single ultra-high-resolution CMOS image sensors containing millions of pixels at sensor sizes far larger than the photo exposure tool (scanner) field size.
This technology is used by the company to offer large X-Ray sensors (up to one die per wafer) on 8’ and 12’ wafers as well as high-end large format photography and industrial sensors with special pixels that the company has developed specifically for this market.
In past years, the company has completed and qualified its next generation CMOS sensor technology, namely BSI and wafer stacking, which combines a digital CMOS wafer with an imager wafer that is then thinned for backside illumination (BSI) with billions of electrical Cu-Cu connections between the two wafers. The company offers both BSI and stacking technologies in 200mm (in cooperation with a third-party that processes several steps of the BSI part of the process on the company’s wafers, using its own developed BSI technology) and in 300mm in the company’s own facilities at TPSCo. The company augmented this technology with additional deep trenches (DTI) between pixels, as well as a unique layer to enhance near infrared response.
The company specially developed its near Infra-Red imaging technology for gesture recognition systems and a series of spectrally sensitive image sensors, including proximity sensors and sensors sensitive in the UV range. The company also announced its iToF (indirect Time of Flight) technology with outstanding performance parameters for fast autofocus and face recognition functions in mobile devices.
In addition, the company developed SPAD (Single Photon Avalanche Diodes) technology for dToF (direct Time of Flight) LIDAR (Light Detection and Ranging) applications in mobile devices, smart automotive Advanced Driver Assistance Systems (ADAS) and Autonomous Driving (AD) vehicles. The company also further developed its stacked technology to support the stacking of a very advanced technology node CMOS wafer with a state-of-the-art SPAD imager, with pixel level electrical connections between the wafers.
MEMS and Displays
In the MEMS area, the company uses MEMS switches technology for fast RF antenna switching and accelerometers for a variety of applications.
The display market is undergoing a dramatic change from LCD-based screens with LED backlighting into micro OLED or micro LED displays, allowing substantially higher dynamic range with true black and higher brightness and dynamic range. The display market spans from small displays, such as smartwatch or VR goggles displays, through smartphone, tablet and laptop displays, to large format TV displays. In today’s technology, all of these displays are glass based, using OLED on glass for the small to medium display sizes. The appearance of the fast-growing VR headset market has created the need for a high-resolution OLED small display that can be manufactured only on Silicon backplane. The company has developed a highly competitive silicon backplane technology for the OLEDoS (OLED on Silicon) market, targeted mainly at the VR market. The company offers a 5V based platform and expect to release a 10V based platform, which will support even higher brightness, by the end of 2024. Due to the large size of such a display compared with a regular CMOS die, this market may grow substantially.
RF CMOS
Many RF products are built today based on RF CMOS technology on silicon-on-insulator (SOI) substrates (RFSOI). These RFSOI process technologies include devices optimized to deliver higher performance and improved isolation relative to devices in bulk RFCMOS process. The company has RFSOI process technologies in 0.18 micron, 0.13 micron and 65 nanometer lithography nodes and fabricate various devices, including antenna switches with record FOM (figure of merit) and front end modules that can be found in various products, including smartphones.
SiGe BiCMOS for RF and High Performance Analog
The company’s SiGe BiCMOS process technologies have more features than RF CMOS or standard BiCMOS processes and are well suited for advanced RF and high-performance analog semiconductors such as high-speed, low noise, front-end wireless components, optical networking components, automotive radar components, hard-disk drive pre-amplifiers, power amplifiers and low-noise amplifiers. These technologies generally incorporate silicon germanium bipolar transistors, which are formed by the deposition of a thin layer of silicon germanium within a bipolar transistor, to achieve higher speed, lower noise, and more efficient power performance than the BiCMOS process technology. It is also possible to achieve higher speed using SiGe BiCMOS process technologies equivalent to those demonstrated in standard RF CMOS processes that are two process generations smaller in line width. For example, a 0.18 micron SiGe BiCMOS process is able to achieve speeds comparable to a 90 nanometer RF CMOS process. As a result, SiGe BiCMOS makes it possible to create analog products using a larger geometry process technology at a lower cost while achieving similar or superior performance to that achieved using a smaller geometry standard RF CMOS process technology. The company developed enhanced tool capabilities in cooperation with large semiconductor tool suppliers to achieve high yield SiGe volumes. This equipment and related process expertise makes the company one of the few companies with demonstrated ability to deliver SiGe BiCMOS products. The company has 0.35 micron, 0.18 micron and 0.13 SiGe BiCMOS technologies available and 65nm SiGe BiCMOS under development.
Silicon Photonics (SiPho)
The company’s industry-leading silicon photonics platform targets optical networking and data center interconnect applications. The SiPho process complements the company’s SiGe BiCMOS processes by providing a companion solution able to integrate optical components in the expanding data communication market. The platform enables integration of photodetectors, optical modulators and other optical components that have in the past been assembled in optical modules as discrete components and can now be integrated in a single die potentially lowering cost, reducing footprint and improving performance of advanced optical transceivers.
Power and Power Management ICs
The company’s power technologies are generally divided into a low-voltage BCD offering and a high-voltage offering, including 140V Resurf, 200V SOI and 700V ultra-high voltage technologies. The company’s low-voltage BCD process technologies have more features than advanced analog CMOS processes and are well suited for power and driver semiconductors, such as voltage regulators, battery chargers, power management products and audio amplifiers. These process technologies generally incorporate higher voltage CMOS devices than advanced analog CMOS processes, such as 5V, 8V, 12V, 40V and 60V devices, and in the case of BCD, bipolar devices integrated into an advanced analog CMOS process. The company has BCD offerings in 0.5 micron, 0.35 micron, 0.25 micron, 0.18 micron and 65 nanometer.
The company’s higher voltage technologies, which include 140V Resurf, 200V SOI and 700V ultra-high voltage platform, support applications such as gate drivers for discrete high-power transistors and automotive, industrial, AC adaptor and lighting markets.
In addition, the company has developed a unique NVM solution (Y-Flash) specifically for power and power management applications in the company’s 0.18 micron and 65nm platforms. The company has developed a series of Y-flash based modules of up to 16kbit, which have been integrated in various power management products of the company’s customers. The company has also introduced high density single Poly silicon memory arrays of other intellectual property vendors into the company’s CMOS process flows.
The company continues to invest in technology that improves performance and integration level and reduces the cost of analog and mixed-signal products. This includes improving the density of passive elements such as capacitors and inductors, including development of the new passive elements, improving the analog performance and voltage handling capability of active devices, and integrating additional advanced features in the company’s specialty CMOS processes. Examples of such technologies under development include GaN technologies for sensor applications and technologies aimed at integrating micro-electro-mechanical-system (MEMS) devices with CMOS, using phase-change materials for more advanced RF switches, scaling the features the company offers to the 65 nanometer process, including the integration of advanced SiGe transistors with 65 nanometer CMOS, and copper metallization.
Customers, Marketing and Sales
The company’s marketing and sales strategy seeks to further solidify its position as the leading foundry of high value analog semiconductor solutions, by increasing the company’s market share at existing customers and expanding the company’s global customer base. The company has marketing, sales, design support engineers, field application engineers and customer support personnel located in many countries worldwide, who have been hired and assigned to these roles based on their industry experience, customer relationships and understanding of the semiconductor marketplace.
The company’s sales cycle is generally 9 to 24 months or longer for new customers and can be as short as 6 to 12 months for existing customers. The typical stages in the sales cycle process from initial contact until production are: technical evaluation; wafer design to the company’s specifications, including the integration of third party intellectual property; photomask–- design and order third-party photomask; silicon prototyping; assembly and test; validation and qualification; and production.
The primary customers of the company’s foundry and design services are fabless semiconductor companies and IDMs. The company’s customers include many analog and mixed-signal industry leaders, serving a variety of end market segments. A portion of the company’s wafer sales are made pursuant to long-term contracts with its customers, under which the company agrees to reserve capacity for certain purchasing commitments. During the year ended December 31, 2023, the company had four significant customers that each contributed between 9% to 14% of the company’s revenues.
To promote the company’s products, technology offering and services, the company publishes press releases, articles, technology journals and white papers. In addition, the company presents and participates in panel sessions at industry conferences, holds a variety of regional and international technology seminars, and exhibits at various industry trade shows. The company discusses advances in its process technology portfolio and progress on specific relevant programs with the company’s prospective and existing customers, as well as industry analysts and research analysts, on a regular basis.
The company’s customers use its processes to design and market a broad range of analog and mixed-signal semiconductors for diverse end markets, including wired and wireless high-speed communications, consumer applications, automotive, medical, security and industrial applications. The company sells wafers for a wide range of markets, including but not limited to, high-performance applications, such as antenna switches, transceivers and power management circuits for cellular phones; transceivers and power amplifiers for wireless local area networking products; power management, audio amplifiers and drivers for consumer applications; tuners for digital televisions and set-top boxes; modem chipsets for broadband access devices and gaming devices; serializer/deserializers, or SerDes, for fiber optic transceivers; high end video cameras, dental and medical x-ray vision, industrial cameras, focal plane arrays for imaging applications; infra-red detectors for gesture recognition, controllers for power amplifier and switching chips in cellular phones and wireline interfaces for switches and routers, magnetic field and gas and UV sensors.
Competition
The company competes most directly in the specialty segment with foundries such as GlobalFoundries (mainly in the RF business), Vanguard Semiconductor, DongBu, X-Fab and Hua Hong Semiconductor. The company also competes in some areas with the pure-play advanced technology node-driven foundry service providers such as Taiwan Semiconductor Manufacturing Corporation (‘TSMC’), United Microelectronics Corporation (‘UMC’) and Semiconductor Manufacturing International Corp. (‘SMIC’).
Wafer Foundry Services
Wafer foundry service mode of work is an intricate process that consists of constructing layers of conducting and insulating materials on raw wafers in intricate patterns that requires hundreds of interrelated steps performed on different types of equipment, and each step must be completed with extreme accuracy to achieve required device performance metrics. The process can be summarized as follows:
Circuit Design. This process begins when a fabless company or IDM designs (or engages a third party or the company to design) the layout of a device’s components and designates the interconnections between each component. The result is a pattern of components and connections that defines the function of the end product. After the product design is completed, foundries provide such companies with processing services of such companies’ device design.
Mask Making. The design for each layer of a semiconductor wafer is imprinted on a photographic negative, called a reticle or mask. The mask is the blueprint for each specific layer of the semiconductor wafer. The company engages external mask shops for the manufacture of such masks.
Wafer Processing. A series of processes in which photosensitive material is deposited on the wafer and exposed to light through a mask, including hundreds of steps (moves) per wafer, such as photolithography, oxidation, etching and stripping of different layers and materials, ion implantation, deposition of thin film layers, chemical mechanical polishing and thermal processing. The final step is wafer probing, which involves inspection of each unit in order to identify those that are operable for assembly. Customers often use third-party service providers for the performance of wafer probing.
Assembly and Test. At this phase, the wafers are transferred to assembly and test facilities. In the assembly process, each wafer is cut into dies, or individual semiconductors, and tested. Defective dies are discarded, while good dies are packaged and assembled. Assembly protects the product, facilitates its integration into the target systems and enables heat dissipation. Following assembly, the functionality, voltage, current and timing of each product is tested. After testing, the completed product is shipped either to the company’s customer or to their customer’s printed circuit board manufacturing facility. The company’s customers often use third party service providers for the performance of wafer assembly and testing, and to a smaller extent, part of such process may be performed independently by the company.
Research and Development
The company’s research and development expenses were $79.8 million for the year ended December 31, 2023.
Proprietary Rights
As of December 31, 2023, the company held 282 patents in force. The company has entered into various patent and other technology license agreements with technology companies, including Synopsys, ARM, Cadence, Mentor Graphics and others, under which the company has obtained rights to additional technologies and intellectual property.
Design Services
To better serve the company’s customers’ design needs using advanced CMOS and mixed-signal processes, the company has entered into a series of agreements with leading providers of physical design libraries, mixed-signal and non-volatile memory design components. These components are basic design building blocks, such as standard cells, interface input-output (I/O) cells, software compilers for the generation of on-chip embedded memory arrays, mixed-signal and non-volatile memory design blocks. To achieve optimal performance, all of these components must be customized to work with the company’s operational processes. These components are used in part of the company’s customers’ chip designs.
The company interacts with customers throughout the design development and prototyping process to assist them in the development of high performance and low power consumption semiconductor designs and to lower their final die, or individual semiconductor, costs through die size reductions and integration. The company provides engineering support and services, as well as operational process support in an effort to accelerate its customers’ design and qualification process so that the company’s customers can achieve faster time to market. The company has entered into alliances with Cadence Design Systems, Inc., Synopsys, Inc., Mentor Graphics Corp., and other suppliers of design automation tools, and also licensed standard cells, I\O and memory technologies from ARM, Synopsys, Inc., and other leading providers of physical intellectual property components. Through these relationships, the company provides its customers with the ability to simulate the behavior of their design in the company’s processes using standard design automation tools.
The applications for which the company’s specialty process technologies are targeted present challenges that require an in-depth set of simulation models. The company provides these models as an integral part of its design support. At the initial design stage, the company’s customers’ internal design teams use the proprietary design kits that the company has developed to design products that can be successfully used with its specialty process technologies. These design kits, which collectively comprise the company’s design library and design platform, allow the company’s customers to quickly simulate the performance of a semiconductor design with the company’s processes, enabling them to refine their product design to ensure alignment to the company’s processes. The company’s process engineers, who have significant experience with analog and mixed-signal semiconductor design and operations, work closely with the company’s customers’ design teams to provide design advice and help them optimize their designs for the company’s processes and their performance requirements. After the initial design phase, the company provides its customers with a multi-project wafer service to facilitate the early and rapid use of the company’s specialty process technologies, which allows them to gain early access to actual samples of their designs. Under this multi-project wafer service, the company schedules a periodic multi-project wafer run in which the company collects several customers’ designs and put them into a single mask set, providing the company’s customers with an opportunity to reduce the cost and time required to test their designs. The company’s design center helps customers accelerate the design-to-silicon process and enhances first-time silicon success by providing them with the required design resources and capabilities namely, accurate device models, rich PDKs, silicon proven ESD (Electro Static Discharge) protection structures for different voltages ranging from 2KV to 15KV and I/Os, special design rules per application and technical support. The company’s design support can assist in all or part of the design flow. The company’s in-depth knowledge of the fab and processes provide a substantive and competitive advantage for the company’s customers, for example when time to market is critical (the company’s design support reduces the number of required runs) or when implementing designs that reach the boundaries of technology. In addition, the company’s IP and design services can assist in relieving some of its customers' problems, providing the specific skills and expertise critical for quick and successful implementation of the company’s customers’ design in the company’s fabs.
Jazz Semiconductor Trusted Foundry
For purposes of the company’s U.S. aerospace and defense business, Tower and Tower NPB have worked with the Defense Counterintelligence Security Agency of the United States Department of Defense (‘DCSA’) to mitigate concern of foreign ownership, control or influence over the operations in Fab 3. The protection and prevention of potential unauthorized access of trusted and classified materials and information was addressed by creating Jazz Semiconductor Trusted Foundry (‘JSTF’) as a subsidiary of Newport Fab LLC, which is directly held by NPB Co., and limiting possession of all trusted and classified information solely to JSTF. JSTF maintains facility security clearance (which is limited but may be remediated) and Trusted Foundry accreditation status.
History
Tower Semiconductor Ltd. was founded in 1993. The company was incorporated in 1993.
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