Shenzhen Fastprint Circuit Tech Co.,Ltd., together with its subsidiaries, designs, produces, and sells printed circuit boards.
Business Segments
The company operates through several key segments, each addressing specific market needs and technological requirements within the electronic circuit industry.
PCB Manufacturing segment
This segment encompasses the design, development, and production of printed circuit boards, which are essential components in electronic devices. The company’s PCB p...
Shenzhen Fastprint Circuit Tech Co.,Ltd., together with its subsidiaries, designs, produces, and sells printed circuit boards.
Business Segments
The company operates through several key segments, each addressing specific market needs and technological requirements within the electronic circuit industry.
PCB Manufacturing segment
This segment encompasses the design, development, and production of printed circuit boards, which are essential components in electronic devices. The company’s PCB products are used in a wide range of applications, including communications equipment, consumer electronics, automotive electronics, industrial automation, and medical devices.
Semiconductor Test Board segment
This segment focuses on the development and supply of semiconductor test boards, which are used in the testing and validation of semiconductor devices.
IC Packaging Substrate segment
This segment has made significant investments in the development and production of IC packaging substrates, including FCBGA and CSP substrates. These advanced substrates are used in the packaging of high-performance integrated circuits, supporting applications in artificial intelligence, high-performance computing, and other cutting-edge fields.
Digital Transformation and Intelligent Manufacturing segment
This segment focuses on the deployment of digital tools and platforms to enhance manufacturing efficiency, process automation, and data-driven decision-making.
Business Strategy
The company’s business strategy is centered on maintaining and enhancing its leadership in the advanced electronic circuit industry through a combination of digital transformation, high-end product development, and customer-centric value creation.
In the FCBGA packaging substrate field, the company’s strategy involves sustained investment in research and development and process innovation. The company is dedicated to achieving industry-leading yield rates and delivery performance, laying the foundation for large-scale mass production.
The company’s core values—customer first, efficiency and reliability, continuous innovation, and shared growth—are embedded in its strategic approach. The company implements a customer classification and grading system, focusing on improving customer satisfaction for top-tier clients through system-wide, process-wide, and zero-defect management. The company’s strategy is to be customer-driven, focusing on understanding customer needs and delivering accurate, efficient services to achieve mutual growth.
Products and Services
The company’s product portfolio is centered on the design, development, and manufacturing of printed circuit boards (PCBs), semiconductor test boards, and integrated circuit (IC) packaging substrates. The company’s products are widely used in various industries, including communications, consumer electronics, automotive electronics, industrial control, medical equipment, and emerging fields such as artificial intelligence and high-performance computing.
Printed Circuit Boards (PCBs): The company offers a comprehensive range of PCB products, including prototype boards, small-batch boards, and mass production boards. The company’s PCB manufacturing capabilities cover high-layer count boards, high-density interconnect (HDI) boards, and other complex structures.
Semiconductor Test Boards: The company develops and supplies semiconductor test boards used for the testing and validation of integrated circuits. These test boards are essential for ensuring the quality and reliability of semiconductor devices before they are integrated into end products.
IC Packaging Substrates: The company produces advanced IC packaging substrates, including FCBGA (Flip Chip Ball Grid Array) and CSP (Chip Scale Package) substrates. These substrates are used in the packaging of high-performance integrated circuits, supporting applications in artificial intelligence, high-performance computing, and other advanced fields.
Digital Transformation Solutions: The company provides digital management systems and solutions that cover the entire production and supply chain process.
Geographical Markets
The company serves both domestic and international markets through its network of subsidiaries and production bases. The company’s international operations are supported by entities such as Fineline Global PTE Ltd., Fineline France SAS, and others, enabling it to provide products and services to customers in various regions around the world.
Customers
The company serves a diverse customer base across multiple industries, including communications, consumer electronics, automotive electronics, industrial control, and medical equipment. The company’s top five customers accounted for a significant portion of its annual sales, with the largest customer representing 12.41% of total sales.
The company’s customer categories include leading enterprises in the electronics, semiconductor, and high-tech industries.
Sales and Marketing
The company’s sales and marketing activities are conducted through a combination of direct sales, customer relationship management, and digital platforms. The company’s marketing strategy emphasizes customer-centricity, focusing on understanding customer needs, delivering customized solutions, and providing high-quality services.
The company’s distribution channels include direct engagement with key customers, participation in industry events, and the use of digital management systems to streamline order processing, production, and delivery. The company’s supply chain management system supports efficient and reliable distribution of products to customers in domestic and international markets.
Government Regulations
The company’s financial statements are prepared in accordance with the ‘Enterprise Accounting Standards—Basic Standards’ and other specific accounting standards, application guidelines, and regulatory requirements issued by the Ministry of Finance and the China Securities Regulatory Commission.
History
Shenzhen Fastprint Circuit Tech Co.,Ltd. was founded in 1993.