CyberOptics Corporation operates as a global developer and manufacturer of high precision sensing technology solutions and system products for inspection and metrology.
The company also develops and manufactures its WaferSense products, a family of wireless, wafer-shaped sensors that provide measurements of critical factors in the semiconductor fabrication process. The company intends to leverage its sensor technologies in the surface mount technology (SMT) and semiconductor industries to deliv...
CyberOptics Corporation operates as a global developer and manufacturer of high precision sensing technology solutions and system products for inspection and metrology.
The company also develops and manufactures its WaferSense products, a family of wireless, wafer-shaped sensors that provide measurements of critical factors in the semiconductor fabrication process. The company intends to leverage its sensor technologies in the surface mount technology (SMT) and semiconductor industries to deliver profitable growth. A key element of its strategy is the continued development and sale of high precision 3D sensors and system products based on its proprietary Multi-Reflection Suppression (MRS) technology. The company’s MRS technology is a 3D optical technology for high-end inspection and metrology with the potential to significantly expand its markets. Another key element in the company’s strategy is the continued development and introduction of new sensor applications for its WaferSense family of products.
The company’s products are used in the SMT and semiconductor industries to significantly improve its customers' manufacturing yields and productivity, and to assist its customers in meeting their rigorous demands for manufacturing quality. The company’s products use a variety of proprietary technologies, such as lasers, optics and machine vision, combined with software, electronics and mechanical design. Its products help manufacturers solve their most complex manufacturing challenges by providing them with key information relating to their manufacturing processes, which allows them to improve production volumes, yields and product quality.
The company manufactures 3D and 2D optical sensors for use in its own proprietary inspection system products and for sale to original equipment manufacturers (OEMs), system integrators and end customers in the SMT and semiconductor capital equipment markets. Its inspection system products are sold to manufacturers of SMT electronic circuit boards to control quality as in-line systems, particularly with respect to complex circuit boards used in smart phones and other high-end electronic products. These products are used by manufacturers to measure screen-printed solder paste, to inspect circuit boards and components after component placement, to confirm proper placement after full assembly of circuit boards and to inspect solder joints on printed circuit boards. The company also sells its inspection system products to leading semiconductor manufacturers and outsourced semiconductor assembly and test (OSAT) companies. Manufacturers of DRAM and Flash Memory use the company’s inspection system products to inspect assembly of their memory modules. The company’s inspection system products are being used for various semiconductor related inspection and metrology applications, including advanced packaging.
The company’s WaferSense family of products assist with yield improvement and tool uptime in semiconductor wafer fabrication and flat panel display manufacturing by providing highly accurate measurements of critical process factors. The company’s products are more accurate when compared to the various manual techniques historically used by semiconductor manufacturers to obtain critical wafer fabrication process measurements. The company has continued to invest in its WaferSense product family and anticipates strong future sales growth for these products.
Operations and Products
Multi-Reflection Suppression Technology
The company has successfully launched a number of products based on its 3D MRS technology, including its SQ3000 Multi-Function systems (SQ3000 and SQ3000 3D CMM) for inspection and metrology; MX3000 memory module inspection system and its 3D NanoResolution MRS sensor; and WX3000 inspection and metrology system for semiconductor wafer and advanced packaging inspection and metrology. The company is continually developing new high precision 3D sensors and system products based on its proprietary MRS technology.
The company has significantly advanced its 3D MRS sensor technology as part of a research initiative aimed at applying its 3D MRS sensor technology to semiconductor advanced packaging inspection and metrology. The company’s next generation ultra-high resolution 3-micron pixel 3D NanoResolution MRS sensor and WX3000 inspection and metrology system perform two to three times faster than alternate technologies at data processing speeds in excess of 75 million 3D data points per second. The 3D NanoResolution MRS sensor and WX3000 system perform 100% 3D and 2D inspection and metrology simultaneously at high speeds, deliver throughput of more than 25 wafers per hours and are capable of accurately measuring feature sizes down to 25 microns, which makes these products suitable for many semiconductor wafer and advanced packaging inspection and metrology applications. The company anticipates that sales of sensors and systems based on 3D MRS technology, including for semiconductor wafer and advanced packaging inspection and metrology, will provide the company with long-term growth opportunities.
The company intends to expand sales of products based on its MRS technology in the SMT and semiconductor markets through new distribution channels, OEM partners, system integrators and direct sales to end-user customers.
High Precision 3D and 2D Sensors
The company manufactures high precision sensors for inspection and metrology in the SMT and semiconductor markets. The company sells its 3D MRS sensors to OEMs and system integrators for use in their proprietary system products. The company integrates its 3D MRS sensors into its own proprietary system products for inspection and metrology. The company’s SMT electronic assembly alignment sensor products are a family of sensors that are customized and incorporated into the equipment manufactured by its customers for use in SMT circuit board assembly. The company works with its OEM customers and system integrators to incorporate its high precision 3D and 2D sensors into their product offerings.
3D MRS Sensors
The company’s proprietary 3D MRS sensor technology enables metrology grade accuracy by inhibiting optical measurement distortions and reflections. Its sensor architecture simultaneously captures and transmits multiple images in parallel while proprietary 3D fusing algorithms merge the images together. The result is ultra-high quality 3D images and high-speed inspection. The company’s 3D MRS sensors are used for inspection and metrology in a variety of applications, including SMT (printed circuit boards), CPU sockets, solder balls and bumps, wafer bumps, copper pillars and other semiconductor wafer and advanced packaging applications.
The company’s 3D MRS sensors can also be used for industrial metrology. Its high precision 3D MRS sensors are based on commercially available cameras, digital light projectors and other hardware components, which are combined with its proprietary MRS technology, 3D fusing algorithms and precision optics. The combination of these elements allow its sensors to capture microscopic quality images at production speeds. The company’s 3D MRS sensors include six models featuring varying fields of view (FOV), 3D acquisition time and minimum feature sizes. Its next generation ultra-high resolution three-micron pixel 3D NanoResolution MRS sensor is capable of measuring feature sizes down to 25 microns accurately and at high speeds, and is suitable for many semiconductor wafer and advanced packaging inspection and metrology applications. The company is targeting one micron, three-sigma accuracy, at speeds that would inspect more than 25 300-millimeter wafers in an hour.
SMT Electronic Assembly Alignment Sensors
The company’s LaserAlign sensors align both large and extremely small surface mount and through-hole components, known as chip capacitors and resistors, during transport on a pick-and-place machine prior to placement. LaserAlign sensors are incorporated into the placement heads of pick-and-place machines to ensure accurate component placement at high production speeds. LaserAlign sensors integrate an intelligent sensor, composed of a laser, optics and detectors with a microprocessor and software for making specific measurements. LaserAlign sensors enable quick and accurate alignment of each component as it is being transported by the pick-and-place arm for surface mount or through-hole assembly. Using non-contact technology, LaserAlign sensors facilitate orientation and placement of components at higher speeds than can be achieved using conventional mechanical or machine vision component centering systems.
The company’s board alignment cameras are used to identify fiducial markings on a circuit board to ensure accurate board registration in a pick-and-place machine or a solder paste screen printer. Accurate board placement is needed to ensure proper placement of solder paste deposits and components on a printed circuit board. In some instances, its board alignment cameras are used for 2D solder paste and stencil inspection.
Inspection and Metrology Systems
The company’s inspection and metrology system products are primarily used in the SMT and semiconductor industries for process control, inspection and metrology. These systems are sold to end-user manufacturing customers that use them in a production line or alongside a production line to maintain process and quality control. The company’s products incorporate its proprietary 3D and 2D optical sensors, off the shelf, translation or robotics hardware and conveyors and complete computer systems or processors with internally developed software.
Automated Optical Inspection (AOI) Products
The company develops and improves its AOI offerings. These products are typically used to inspect circuit boards after component placement to determine whether all components have been placed correctly, and to measure the quality of solder joints after reflow. These products can also be used for various semiconductor related inspection and metrology applications, including wafer and advanced packaging applications, and for certain industrial metrology applications.
SQ3000 Multi-Function systems (SQ3000 and SQ3000 3D CMM): The company’s SQ3000 Multi-Function systems for AOI, solder paste inspection (SPI) and coordinate measurement (CMM) applications, are designed to expand its presence in markets requiring high precision inspection and metrology. The combination of the company’s proprietary 3D MRS sensor technology, Ai2 (Autonomous Image Interpretation) software and sophisticated 3D fusing algorithms allows the company to offer microscopic image quality at production line speeds. The SQ3000 is an all-in-one solution for AOI and SPI in a single product. The SQ3000 3D CMM goes a step further by adding metrology functionality. Manufacturers in a variety of industries, including the SMT and semiconductor markets, can use the SQ3000 3D CMM as an in-line or off-line metrology tool to help solve complex manufacturing and product quality challenges.
The company’s SQ3000 Multi-Function systems are available in versions that can accommodate dual production lanes and larger circuit board sizes.
QX Series 2D AOI Products: The company’s QX AOI systems feature its strobe inspection module (SIM) sensor technology and are designed for 2D inspection of circuit boards. The company offers QX products with varying levels of resolution and inspection speeds. The company also offers versions of the QX product that can accommodate dual production lanes, larger circuit board sizes and both top and bottom inspection of a circuit board.
MX Products: The company’s MX products are used for inspection of memory modules following the singulation step of the manufacturing process. The company’s MX600 system utilizes its SIM sensor technology and Ai2 software, and is used for 2D inspection of memory modules. The company’s MX3000 system utilizes its 3D MRS sensor technology, SQ3000 system software and Ai2 software; and is used for 3D inspection of memory modules.
SPI Products
SE3000: The SE3000 is an in-line system solder paste inspection system based on the company’s 3D MRS sensor technology. The SE3000 measures in 3D the amount of solder paste applied to a circuit board after the first step of the SMT circuit board assembly process. The SE3000 inspects the height, area and volume of solder paste placed on an entire circuit board at production line speeds and with resolution that allows the SE3000 to measure the smallest chip scale packages and micro ball array component sites. The SE3000 can be integrated into most SMT production lines, providing real time quality control immediately after a printed circuit board leaves the screen printer and before component placement commences.
SE600: The SE600 is an in-line solder paste inspection system incorporating a dual-illumination sensor that measures in 3D the height, area and volume of solder paste placed on an entire circuit board at production line speeds. The SE600 can be integrated into most SMT production lines.
SE500ULTRA: The SE500ULTRA is an in-line solder paste inspection system incorporating the same proprietary 3D inspection technology as the SE600 but utilizes a single illumination sensor. The SE500ULTRA inspects at faster speeds than the SE3000 or SE600 and is intended for use in high-volume production environments.
Semiconductor Wafer and Advanced Packaging Products
The company’s new WX3000 system is suitable for many semiconductor wafer and advanced packaging inspection and metrology applications. The WX3000, which incorporates its next generation ultra-high resolution 3D NanoResolution MRS sensor, performs 100% 3D and 2D inspection and metrology simultaneously at high speeds and delivers throughput of more than 25 wafers per hour. The WX3000 is suitable for many high volume semiconductor wafer and advanced packaging inspection and metrology applications for feature sizes down to 25 microns.
General Industrial Metrology Products and Services
CyberGage360: Manufacturers in a variety of industries use CyberGage360 as a near-line or off-line metrology tool to capture surface data to help solve complex manufacturing and product quality challenges.
Other Metrology Products and Services: The company also sells 3D scanning and metrology equipment manufactured by other suppliers and provides 3D scanning and metrology services for objects of all sizes and complexity for customers that do not have their own 3D scanning and metrology equipment.
Semiconductor Sensors
The company’s principal semiconductor products, the WaferSense family of products, are a series of wireless sensors that provide measurements of critical factors in the semiconductor fabrication process. The company designed its WaferSense family of sensors to be used where wafers or reticles are located in semiconductor fabrication to provide measurements of critical factors that are impossible or extremely difficult to obtain without powering down the fabrication process equipment.
Automatic Leveling Sensor (ALS): The ALS is a wireless, vacuum-compatible sensor that can be placed in cassettes, FOUPS, on-end effectors, aligners, in-load locks and process chambers used in semiconductor fabrication to ensure that all stations are level and coplanar.
Automatic Gapping Sensor (AGS): The AGS is a gapping tool that measures the gap in three places between the showerhead and pedestal in semiconductor process equipment. The amount of gap between the showerhead and pedestal can affect uniformity when material is deposited on semiconductor wafers.
Automatic Teaching Sensor (ATS): The ATS measures X-Y-Z offset from robotic transfers of wafers to the pedestal in semiconductor process equipment. The amount of gap and offset after robotic transfer of wafers to the shower pedestal can affect film thickness and uniformity when material is deposited or etched on semiconductor wafers, impacting quality and product yields.
Automatic Vibration Sensor (AVS): The AVS measures X-Y-Z acceleration for shock and vibration, which can generate wafer particles, scratches or wafer breakage that reduce yield.
WaferSense Airborne Particle Sensor: The WaferSense airborne particle sensors (APS) allow engineers to efficiently detect and classify particles and their exact sources in a process as wafers are transferred, slit valves are actuated and chambers are cycled, pumped down and purged. APS sensors are designed to be compatible with front-ends, coater/developer tracks, and deposition and etch equipment.
ReticleSense Airborne Particle Sensors allow users to identify geographic particle sources in reticle environments. The ReticleSense Airborne Particle Sensor is compatible with ASML, Nikon and Canon scanners and can travel the entire reticle path to detect in real-time when and where particles might exist. The ReticleSense Airborne Particle Sensor helps the company’s customers exceed manufacturing quality and productivity standards in the Photo lithography scanner environment.
In-Line Particle Sensor: The In-Line Particle Sensor (IPS) with CyberSpectrum software detects particles in gas and vacuum lines 24/7 in semiconductor process equipment. The IPS quickly identifies, monitors and enables troubleshooting of particles down to 0.1 micron in size. The IPS can be installed in any gas or vacuum system, and is particularly relevant for EUV lithography tools where the ability to monitor particles in-line can significantly improve EUV lithography tool yield and productivity. For example, an IPS can be installed at the vacuum line in between the EUV process chamber and the vacuum pump, saving significant time compared to methods of sending a monitor dummy reticle into the EUV system to check for particles before and after sending the reticle into the EUV system. The IPS is constantly collecting data, which is especially critical during chamber purging. Process and equipment engineers in semiconductor fabs can increase the speed of equipment qualification. Contamination sources can be identified quickly and the effects of cleaning, adjustments and repairs can be seen in real-time. Through use of the IPS, fabs can shorten equipment maintenance cycles, lower equipment expenses and optimize preventative maintenance plans.
WaferSense Auto Multi Sensor: The WaferSense Auto Multi Sensor is an all-in-one wireless real-time device that allows engineers to take leveling, vibration and humidity measurements. Humidity measurements are becoming more important as the use of Fin Field Effect Transistor technology increases among semiconductor manufacturers. The ReticleSense Auto Multi Sensor allows users to take leveling, vibration and humidity measurements in reticle environments.
WaferSense 300mm Auto Resistance Sensor: The WaferSense 300mm Auto Resistance Sensor (ARS) with CyberSpectrum software enables real-time resistance measurements of plating cell contacts in semiconductor Electrochemical Deposition (ECD) applications. The ARS identifies and monitors resistance measurements with 50 separate pads around the perimeter utilizing a Kelvin sensing (4-wire resistance) method to detect residue affecting plating pins. Process and equipment engineers in semiconductor fabs can predict when a tool needs maintenance with quantitative analysis of measured mean resistance over time, shorten equipment maintenance cycles, and improve cell-to-cell uniformity with the wafer-like, 4-wire resistance sensor and CyberSpectrum software's objective and repeatable data.
WaferSense Auto Vibration and Leveling Sensor: The WaferSense Auto Vibration and Leveling Sensor (AVLS3) with a thickness of 3.5mm can travel to most locations and tools within a semiconductor fab where a real semiconductor wafer travels. The Chemically Hardened Glass (CHG) substrate enables smooth wafer handling and improved vacuum chucking. The AVLS3, with CyberSpectrum software, collects and displays both vibration and leveling data simultaneously for fast equipment set-up and alignment and real-time equipment diagnostics to speed equipment qualification and shorten equipment maintenance cycles.
Markets and Customers
The company sells the majority of its products into the markets for SMT and semiconductor inspection and metrology.
High Precision 3D and 2D Sensors
3D MRS Sensors
The company sells its 3D MRS sensors to OEM customers for use in semiconductor component package inspection. The company has an agreement to supply Nordson-YESTECH with 3D MRS sensors for its 3D AOI inspection equipment serving the SMT market. The company sells its 3D MRS sensors, including its next generation ultra-high resolution 3D NanoResolution MRS sensor, to OEMs and system integrators that make capital equipment for semiconductor manufacturers and OSATs.
SMT Electronic Assembly Alignment Sensors
The vast majority of the company’s SMT electronic assembly alignment sensors are sold on an OEM basis to Juki Corporation; Kulicke & Soffa Industries, Inc.; and ASM Pacific Technology Ltd. for integration into DEK brand equipment serving the SMT circuit board assembly market. Viscom AG purchases the company’s SPI sensors on an OEM basis for integration into their SPI inspection equipment.
Inspection and Metrology Systems
The company sells its AOI and SPI inspection and metrology systems to many of the leading SMT electronic assembly circuit board manufacturers, end-user customers manufacturing their own circuit boards, semiconductor manufacturers and OSAT companies. Manufacturers of DRAM and Flash Memory use its inspection system products to inspect assembly of their memory modules.
Semiconductor Sensors
The company’s semiconductor products, primarily its WaferSense family of products, are used by process and equipment engineers as non-contact precision measurement tools to optimize the process for production of semiconductor wafers and manufacturing of flat panel displays. Most of the world’s largest manufacturers of semiconductors and semiconductor equipment purchase the company’s WaferSense products.
Sales and Marketing
The company markets its products by offering on-site demonstrations and evaluations, through appearances at industry trade shows, advertising in industry journals, articles published in industry and technical journals and on the Internet. The company supports its sales efforts by utilizing internet-based search engine marketing programs to generate leads from prospects who have expressed interest in obtaining the types of products and services that it offers.
High Precision 3D and 2D Sensors
The company’s high precision 3D and 2D sensors are sold in most countries to OEMs and system integrators by direct sales personnel located in Minnesota and Asia. Some of the global channel partners for its other products also market the company’s high precision 3D MRS sensors to system integrators and semiconductor manufacturers.
Inspection and Metrology Systems
The company’s AOI and SPI inspection and metrology system products are sold in most countries. The company has just started marketing its new WX3000 system for semiconductor wafer and advanced packaging inspection and metrology. Sales and marketing of its AOI, SPI and WX3000 system products are more heavily concentrated in Asia where a significant portion of the worldwide production capacity for circuit board assembly and semiconductor manufacturing occurs.
The company’s AOI, SPI and WX3000 system products are sold by direct sales personnel located in the United States, the United Kingdom, Singapore, Taiwan and China; and through independent sales representatives and distributors. The company has sales and service team members based in the United States and Mexico to serve the Americas market. Its sales and service office in the United Kingdom serves the European market. The company has sales and service offices in Singapore, Taiwan, and China to serve the markets for SMT and semiconductor inspection and metrology equipment in Asia.
The company has agreements with 43 independent sales representatives and distributors, which focus on sales and service of its AOI, SPI and WX3000 inspection and metrology system products to end-user customers. These agreements cover North and South America (14), Europe (16), and China and the Asia-Pacific (13). The company sells its general industrial metrology products and services to end-user customers mainly through a direct sales staff located in Minnesota.
Semiconductor Sensors
The company sells its semiconductor products, primarily its WaferSense family of products, to semiconductor fabrication facilities through a separate worldwide sales channel of independent sales representatives and distributors. The company also sells its WaferSense products directly to large OEM customers, which are mainly semiconductor capital equipment manufacturers. The company has agreements in place or in process with 14 independent sales representatives and distributors, which focus on sales and service for its WaferSense products. These agreements cover the United States (4), Europe (3) and the Asia-Pacific (7). The company’s sales to OEM customers and its worldwide network of independent sales representatives and distributors are managed by direct sales personnel located in the United States and Asia.
Research and Development
The company’s research and development expenses were $9.6 million in 2020.
Proprietary Protection
The company holds 53 patents (28 U.S. and 25 foreign) on a number of technologies, including the technologies used in its SQ3000 Multi-Function systems for AOI, SPI and CMM applications; other SMT inspection systems; MRS high-precision 3D sensors; SMT electronic assembly alignment sensors, SIM sensors and semiconductor sensors, primarily consisting of its WaferSense wireless measurement devices; and other products.
In addition, the company has 44 pending patents (10 U.S. and 34 foreign). The company utilizes 31 registered trademarks (12 U.S. and 19 foreign) and has 4 trademark registrations pending. It also has 12 domain names and several common law trademarks.
Competition
High Precision 3D and 2D Sensors
The company’s SMT electronic assembly alignment sensor products compete with vision (camera and software-based) systems and component libraries available from Cognex Corporation and others.
Inspection and Metrology Systems
The primary competition for sales of the company’s AOI and SPI inspection and metrology system products has been from Korean-based companies, including Koh Young Technology, MirTec Ltd., and PARMI Co. Ltd. The company also competes with Taiwanese-based Test Research, Inc. and German-based Viscom AG, among others.
The company’s competitors in the markets for semiconductor wafer and advanced packaging inspection and metrology equipment include, among others, Camtek, Inc.; Unity SC; Utechzone Co. Ltd.; and Onto Innovation, Inc.
The primary competition for the various metrology products and solutions the company sells include coordinate-measuring machines sold by Hexagon, Zeiss and others.
History
CyberOptics Corporation was founded in 1984. The company was incorporated in 1984.
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